ASML machines are hitting tin droplets with 25kW laser 50,000 times a second to turn them into plasma to create the necessary extreme ultraviolet light, and despite generating 500W of EUV, only a small fraction can reach the wafer, due to loses along the way. I believe it was like 10%.
Here’s an incredible, very detailed video about it: https://youtu.be/B2482h_TNwg
Maybe the high water usage is at some other stage? Or intermediate preceding stages?
As someone who knows nothing about PCB, from those images it appears that double side printing of some sort is happening.
Please correct me if I'm wrong.
I think what you're seeing is the silicon layers visible from the back through the bulk substrate, and the metal layers on the front.
English subtitles are recommended, unless you are better at Chinese than I am.
ARM were catching up to Apple in terms of big core, now Apple has leapfrogged in E-Core again. But competition is good. ARM should have some announcement coming in next few months.
nomel•2h ago
This definitely isn't the original, since the blue text at the bottom right isn't even legible.
Neywiny•2h ago
system2•2h ago
paulsen•2h ago
"High Resolution Floorplan images available here"
With some contact info below that
It is moved to the end of the page on mobile it seems
daemonologist•2h ago
bigwheels•58m ago
The A19 appears to be remarkably intricate chip.