Optimal: piecemeal. As in: X sockets on a board, each socket takes a chip that adds CPU core(s), GPU cores, and some amount of main RAM. More chips, more powerful computer.
Keyword: socket. Read: replaceable. Bad chip out, good chip in. Slow chip out, faster chip in. Soldered onto board = reliable, but a defect could junk the whole machine.
Haven't Apple (A-series, M-series) and others been copackaging memory for a while? (SiP or MCM?)
Can't you select and copy the text in the photo (on most smartphones and PCs at least)?
Besides, since RAM isn't getting cheaper for a while, this isn't a big issue now.
"Smartphone makers glue them because it's cheaper and they can make more money ..." No. It's what the consumers want. Thinner phones, water resistant phones, and thinner laptops.
The issue, of course, is just how much time, effort and skill is required to do it.
It might become a viable commercial process outside third world countries if RAM prices spike even more - or if someone finds a way to teach an off the shelf $1000 robot arm advanced autonomous microsoldering.
Then there's the problem of forcing the device itself to recognize the new RAM. It's a device-specific trick. RAM sticks have a little tag chip that tells a PC "how much RAM this stick has", but RAM chips themselves don't - so the device has to infer its RAM capacity from elsewhere. Like strap resistors on the board. Which you have to find and adjust for the new RAM capacity. That, or fix the RAM values in firmware, which is also device-specific.
I'm surprised that in 2026 this is still true.
You could easily fit a little microcontroller on the die of each RAM chip which reports its make/model/manufacturing date, capacity and capabilities, can be triggered to run self-tests, etc. If they aren't doing that yet, I'm surprised that they aren't.
Then there is the HBM which is an expensive process to mount on the chip.
Good BGA experience and a steady hand seems required
As for the videos and the Macs, you can see the same people (likely) soldering RAM as well.
potamic•1d ago
rasz•1d ago
ACCount39•34m ago
I've been eyeing LPCAMM2 interposers for non-RAM uses - as an off the shelf connector for stacked PCB designs. The conclusion was that it wasn't produced or used at sufficient scale for it to work.
dist-epoch•18m ago
https://www.koreatimes.co.kr/business/tech-science/20260420/...
eqvinox•23m ago
noman-land•14h ago
https://frame.work/blog/framework-laptop-13-pro-deep-dive-lp...
nicman23•1h ago
snvzz•15m ago
mrheosuper•35m ago
bugake•7m ago